Tue. Dec 7th, 2021

The Info‘s Wayne Ma right this moment shared alleged particulars about future Apple silicon chips that may succeed the first-generation M1, M1 Professional, and M1 Max chips, that are manufactured primarily based on Apple chipmaking companion TSMC’s 5nm course of.

m1 pro vs max feature
The report claims that Apple and TSMC plan to fabricate second-generation Apple silicon chips utilizing an enhanced model of TSMC’s 5nm course of, and the chips will apparently include two dies, which might permit for extra cores. These chips will seemingly be used within the subsequent MacBook Professional fashions and different Mac desktops, the report says.

Apple is planning a “a lot greater leap” with its third-generation chips, a few of which might be manufactured with TSMC’s 3nm course of and have as much as 4 dies, which the report says may translate into the chips having as much as 40 compute cores. For comparability, the M1 chip has an 8-core CPU and the M1 Professional and M1 Max chips have 10-core CPUs, whereas Apple’s high-end Mac Professional tower will be configured with as much as a 28-core Intel Xeon W processor.

The report cites sources who count on TSMC to have the ability to reliably manufacture 3nm chips by 2023 to be used in each Macs and iPhones. The third-generation chips are codenamed Ibiza, Lobos, and Palma, in accordance with the report, and it is seemingly they are going to debut in higher-end Macs first, comparable to future 14-inch and 16-inch MacBook Professional fashions. A much less highly effective third-generation chip can be stated to be deliberate for a future MacBook Air.

In the meantime, the report says the following Mac Professional will use a variant of the M1 Max chip with at the very least two dies, as a part of the primary technology of Apple silicon chips.

Source link

By admin

Leave a Reply

Your email address will not be published. Required fields are marked *